Simple BGA Rework System
Features
Bsoldering855PG
1. Only 10s needed to desolder IC.
2. Password can be set to protect menu from inadvertent changes.
3. Key-lock function can protect parameters from inadvertent changes.
4. Excellent desoldering efficiency and speed. The whole process includes six programming phases, in which process parameters can be set according to various requirements.
5. 10 program channels available.
6. With vacuum suction pen, easy to use.
7. Large LCD display shows temperature, air volume, working time, etc.
8. Digital temperature calibration, easy and convenient.
9. Magnetic switch and pedal switch available makes our units easy to use.
10. Accurate temperature. Closed-loop temperature control ensures temperature stability up to ±2℃.
11. Auto sleeping, energy-efficient. Auto cooling function can prolong the lifetime of the heating element and protect the unit.
12. Working time can be set within a range of 1-999s.
Bsoldering855T
1. Infrared ceramic heater, rapid heating, high efficiency, long lifetime.
2. Temperature controlled by K type thermocouple, closed loop with zero voltage heater switching, digital display, easy operation.
3. Can be used with Bsoldering855PG for maintenance of SMD and BGA.
4. The arm of Simple BGA Rework System can move easily and conveniently, easy operation.
5. Parts that need preheating can be placed on the stainless steel or fixture (assembled in addition).
6. Two switches are used to control power and heating separately. The temperature of the plate can also be read even in no heating status.
7. Built-in thermometer. Temperature of PCB can be easily tested.
8. Can control external cooling fan.
Specifications
Bsoldering855PG
| Rated output | 1300W |
| Temperature range | 100℃-500℃ |
| Air volume | From 6-200 class; Can set freely |
| Program phase | Six phases |
| Vacuum suction force | 0.03MP |
| Temperature stability | ±2℃ |
| Channel quantity | Ten |
| Anti-static | ESD Safe by design |
Bsoldering855T
| Heating power | 800W |
| Plate area | 135*250mm |
| Material of heater | Ceramic |
| Temperature sensor | K type Thermocouple |
| Temperature range | 50℃-350℃ |
| Temperature stability | ±1℃ |
| Ambient temperature | 0℃-40℃ |
| Measurement range of thermocouple | Room temperature-600℃ |
| Accuracy | ±8℃ |
Features
1. Open-type dark infrared heating, non-contact infrared temperature sensor monitoring the surface temperature changes of BGA, closed-loop control, precise temperature technical window and even heat distribution.
2. Large area of bottom infrared heating, preventing PCB from deformation.
3. Vacuum will generate when the process is finished. Rework system can pick up BGA components automatically.
Specifications
| Power | 2400W (max) |
| Bottom Preheating Power | 400W*4=1600W (Infrared ceramic plate) |
| Top Heating Power | 720W (Infrared heating tube, wave 2~8µm, size: 60*60mm) |
| Preheating Area of Bottom Heater | 260*260mm |
| Rang of Top Heater Area | 20~60mm |
| Heating Time of Top Heater | Around10s (Room temperature~230℃) |
| Vacuum Pump | 12V/300mA, 0.05Mpa |
| External Cooling Fan Mode | Bsoldering855F |
| Communication | Standard RS-232C (Connect with PC) |
| External Keyboard | 8 buttons (CAL) |
| Motor | 24VDC/100mA |
| Arm Range (up and down) | 93mm |
| Infrared Temperature Sensor | 0~300℃ (Measurement range) |
| Dimensions | 330(L)×380(W)×440(H)mm |
| Weight | 20Kg |
Note: Please mark the working voltage when place order.
Features
1. Open-type dark infrared heating, non-contact infrared temperature sensor, monitoring the surface temperature changes of BGA, closed-loop control, precise temperature technical window and even heat distribution.
2. Large area of bottom infrared heating, preventing PCB from deformation.
Specifications
| Power | 2400W (max) |
| Bottom preheating power | 400W*4=1600W (Infrared ceramic plate) |
| Top heating power | 720W (Infrared heating tube, wave 2~8µm, size: 60*60mm) |
| Preheating area of bottom heater | 260*260mm |
| Range of top heater area | 20~60mm |
| Heating time of top heating | Around10s (Room temperature~230℃) |
| Vacuum pump | 12V/300mA, 0.05Mpa |
| External cooling fan mode | Bsoldering855F |
| Communication | Standard RS-232C (Connect with PC) |
| External keyboard | 8 buttons (CAL) |
| Motor | 24VDC/100mA |
| Arm range(up and down) | 93mm |
| Infrared temperature sensor | 0~300℃ (Measurement range) |
| Dimensions | 330(L)×380(W)×440(H)mm |
| Weight | 20Kg |
| Standard Moveable Fixture | I760 |
Specifications
| Max power | 2200Watt(max) |
| Bottom preheating power | 1500Watt(Infrared heating tube) |
| Top heating power | 720Watt(Infrared heating tube, Size: 60m*60 mm) |
| Preheating area of bottom heater | 260*260mm |
| Rang of top heater | 20~60mm |
| Heating time of top heater | Approx 10s ( From room temperature to 230℃) |
| LCD display screen | Size: 65.7*23.5 (mm) 16*2 character |
| Communication | Standard RS-232C (Connect with PC) |
| Infrared temperature sensor | 0~300℃ (Testing range) |
| Outside K type sensor | Optional |
| Dimension | 33*38*44 (cm) |
| Weight | 20Kg |
Note: Please mark the working voltage when placing an order.
