Low Density Thermal Interface Pad
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Low Density Thermal Interface Pad
AMG low density thermal interface pads, with lighter weight than traditional thermal pads, can be used to fill the gaps between heating components and heat sinks to realize both thermal conductivity and shock dampening functions.
FeaturesAMG’s low density GTP gap pads feature a number of outstanding properties, including customization options to meet a variety of customer requirements.- Low density of 1.2~2.0 g/cm3
- Soft, natural tacky, highly compressible and highly resilient
- Shock dampening
- Adjustable parameters
- RoHS, REACH, UL certifications
- Computer and telephone: server, microprocessor, cache chip
- Household appliances: TV, stereo equipment, higher dryer
- Automatic control equipment
- Lighting equipment
- New energy vehicle
- Power supply
- Thermal conductivity: 1.0~2.0 W/m·K
- Hardness Shore 00: 5~60
- Thickness: 0.1~20 mm
- Density: 1.2~2.0 g/cm3
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